- All sections
- H - Electricity
- H01R - Electrically-conductive connections; structural associations of a plurality of mutually-insulated electrical connecting elements; coupling devices; current collectors
- H01R 13/504 - Bases; Cases composed of different pieces different pieces being moulded, cemented, welded, e.g. ultrasonic, or swaged together
Patent holdings for IPC class H01R 13/504
Total number of patents in this class: 620
10-year publication summary
|
42
|
33
|
52
|
64
|
87
|
54
|
78
|
50
|
35
|
10
|
| 2015 | 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Foxconn Interconnect Technology Limited | 1034 |
52 |
| Sumitomo Wiring Systems, Ltd. | 9367 |
35 |
| Yazaki Corporation | 6282 |
26 |
| Molex, LLC | 1792 |
24 |
| Dongguan Luxshare Technologies Co., Ltd. | 191 |
24 |
| Apple Inc. | 50209 |
21 |
| Sumitomo Electric Industries, Ltd. | 14131 |
21 |
| AutoNetworks Technologies, Ltd. | 5809 |
21 |
| Robert Bosch GmbH | 40953 |
16 |
| Foxconn (Kunshan) Computer Connector Co., Ltd. | 286 |
13 |
| Phoenix Contact GmbH & Co. KG | 2202 |
12 |
| TE Connectivity Solutions GmbH | 2580 |
12 |
| Japan Aviation Electronics Industry, Limited | 1585 |
9 |
| Medtronic, Inc. | 9964 |
8 |
| Guangdong Oppo Mobile Telecommunications Corp., Ltd. | 18739 |
8 |
| Tyco Electronics (shanghai) Co. Ltd. | 759 |
7 |
| Advanced Connectek Inc. | 338 |
7 |
| CommScope Technologies LLC | 4937 |
6 |
| TE Connectivity Germany GmbH | 655 |
6 |
| Tyco Electronics Japan G.K. | 382 |
5 |
| Other owners | 287 |